PASTE FLUX-DANDIX 1-1/2 OZ
For use in low temperature brazing and silver soldering ferrous and non-ferrous metals. Begins to dissolve oxides at 800¬_F (427¬_C) and is fluid- active between 1100¬_ and 1600¬_F (593¬_ and 871¬_C). Contains no fluoride.
Additional Information:
| PLU: | 54.440 |
